Wafer Cutting and Distribution System
- Wafer cutting machines cut the wafer books discharged from the wafer block cooler to smaller wafer fingers in the desired size.
- Single and double cutter version.
- Block turner device for longitudinal wafer block feeding in case of any need.
- Automatic infeed unit at the entrance of the machine.
- Clear-cuts by means of stainless stell cutting knives fixed on the exchangeable stainless cutting frames.
- Capacity up to 14 blocks/minute for single-cutter version
- The total waste ratio after the cutting operation is maximum % 5 of the blocks. This is aprox 5 mm from each side of the block. (This depends on the final cutting dimensions of the product.)